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PD -94346 GA150KS61U IGBT INT-A-PAK Features * Generation 4 IGBT technology * UltraFast: Optimized for high operating frequencies 8-40 kHz in hard switching, >200 kHz in resonant mode * Very low conduction and switching losses * HEXFREDTM antiparallel diodes with ultra- soft recovery * Industry standard package * UL approved 3 1 6 7 Low Side Switch Chopper Module Ultra-FastTM Speed IGBT VCES = 600V VCE(on) typ. = 1.7V 2 @VGE = 15V, IC = 150A Benefits * Increased operating efficiency * Direct mounting to heatsink * Performance optimized for power conversion: UPS, SMPS, Welding * Lower EMI, requires less snubbing Absolute Maximum Ratings Parameter VCES IC @ TC = 25C ICM ILM IFM VGE VISOL PD @ TC = 25C PD @ TC = 85C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Pulsed Collector Current Peak Switching Current Peak Diode Forward Current Gate-to-Emitter Voltage RMS Isolation Voltage, Any Terminal To Case, t = 1 min Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Range Storage Temperature Range Max. 600 150 300 300 300 20 2500 440 230 -40 to +150 -40 to +125 Units V A V W C Thermal / Mechanical Characteristics Parameter RJC RJC RCS Thermal Resistance, Junction-to-Case - IGBT Thermal Resistance, Junction-to-Case - Diode Thermal Resistance, Case-to-Sink - Module Mounting Torque, Case-to-Heatsink Mounting Torque, Case-to-Terminal 1, 2 & 3 Weight of Module Typ. -- -- 0.1 -- -- 200 Max. 0.28 0.35 -- 4.0 3.0 -- Units C/W N. m g www.irf.com 1 11/06/01 GA150KS61U Electrical Characteristics @ TJ = 25C (unless otherwise specified) V(BR)CES VCE(on) VGE(th) VGE(th)/TJ gfe ICES VFM IGES Parameter Collector-to-Emitter Breakdown Voltage Collector-to-Emitter Voltage Min. Typ. Max. Units Conditions 600 -- -- VGE = 0V, IC = 1mA -- 1.7 2.3 VGE = 15V, IC = 150A -- 1.7 -- V VGE = 15V, IC = 150A, TJ = 125C Gate Threshold Voltage 3.0 -- 6.0 IC = 750A Temperature Coeff. of Threshold Voltage -- -11 -- mV/C VCE = V GE, IC = 750A Forward Transconductance -- 152 -- S VCE = 25V, I C = 150A Collector-to-Emitter Leaking Current -- -- 1.0 mA VGE = 0V, VCE = 600V -- -- 10 VGE = 0V, VCE = 600V, TJ = 125C Diode Forward Voltage - Maximum -- 1.4 2.0 V IF = 150A, VGE = 0V -- 1.4 -- IF = 150A, VGE = 0V, TJ = 125C Gate-to-Emitter Leakage Current -- -- 250 nA VGE = 20V Dynamic Characteristics - TJ = 125C (unless otherwise specified) Qg Qge Qgc td(on) tr td(off) tf Eon Eoff (1) Ets (1) Cies Coes Cres trr Irr Qrr di(rec)M/dt Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Energy Turn-Off Switching Energy Total Switching Energy Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak ReverseCurrent Diode Recovery Charge Diode Peak Rate of Fall of Recovery During tb Min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. 624 121 212 241 145 336 227 6.0 12 19 13878 867 181 139 100 6938 4682 Max. Units Conditions 937 VCC = 400V 182 nC IC = 94A 317 TJ = 25C -- RG1 = 27, RG2 = 0, -- ns IC = 150A -- VCC = 360V -- VGE = 15V -- mJ -- 33 -- VGE = 0V -- pF VCC = 30V -- = 1 MHz -- ns IC = 150A -- A RG1 = 27 -- nC RG2 = 0 -- A/s VCC = 360V di/dt =1400A/s 2 www.irf.com GA150KS61U 1000 1000 I C , Collector-to-Emitter Current (A) I C , Collector-to-Emitter Current (A) TJ = 25 o C TJ = 125 o C 100 T = 125 o C J 100 TJ = 25 oC 10 10 1 2 V GE = 15V 20s PULSE WIDTH 3 1 25V VVCE = 25V CC 50V 5s PULSE WIDTH 80s PULSE WIDTH 5 6 7 8 9 VCE , Collector-to-Emitter Voltage (V) VGE , Gate-to-Emitter Voltage (V) Fig. 1 - Typical Output Characteristics Fig. 2 - Typical Transfer Characteristics 160 3.0 120 VCE , Collector-to-Emitter Voltage(V) VGE = 15V 80 us PULSE WIDTH Maximum DC Collector Current(A) IC = 300 A 80 2.0 IC = 150 A 40 IC = 75 A 0 25 50 75 100 125 150 1.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 TC , Case Temperature ( C) TJ , Junction Temperature ( C) Fig. 3 - Maximum Collector Current vs. Case Temperature Fig. 4 - Typical Collector-to-Emitter Voltage vs. Junction Temperature www.irf.com 3 GA150KS61U 25000 VGE , Gate-to-Emitter Voltage (V) 20000 VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc 20 VCC = 400V I C = 94A 16 C, Capacitance (pF) Cies 15000 12 10000 8 Coes 5000 Cres 4 0 1 10 100 0 0 100 200 300 400 500 600 700 VCE , Collector-to-Emitter Voltage (V) QG , Total Gate Charge (nC) Fig. 5 - Typical Capacitance vs. Collector-to-Emitter Voltage Fig. 6 - Typical Gate Charge vs. Gate-to-Emitter Voltage 1 Thermal Impedance - Z thJC D = 0.50 0.1 0.20 0.10 0.05 0.02 0.01 Single Pulse (Thermal Resistance) P DM t 1 t2 N otes: 1. Duty factor D = t1 / t 2 2. Peak T = PD x Z thJC + TC M J 0.01 0.0001 0.001 0.01 0.1 1 10 100 1000 t 1 , Rectangular Pulse Duration (Seconds) Fig. 7 - Maximum Effective Transient Thermal Impedance, Junction-to-Case 4 www.irf.com GA150KS61U 30 VCC = 360V VGE = 15V TJ = 125C 25 I C = 1500A 100 IC = 300A Total Switching Losses (mJ) Total Switching Losses (mJ) IC = 150A IC = 75A 20 10 15 RG1 = 27, RG2 = 0 VGE = 15V VCC = 360V 1 10 0 10 20 30 40 50 0 20 40 60 80 100 120 140 160 RG, Gate Resistance () T J, Junction Temperature (C) Fig. 8 - Typical Switching Losses vs. Gate Resistance Fig. 9 - Typical Switching Losses vs. Junction Temperature 50 400 Total Switching Losses (mJ) 40 VGE = 15V VCC = 360V IC, Collector-to-Emitter Current (A) RG1 = 27, R = 0 G2 TJ = 150C VGE = 20V T J = 125 VCE measured at terminal (Peak Voltage) 300 30 200 20 SAFE OPERATING AREA 100 10 0 0 50 100 150 200 250 300 0 0 100 200 300 400 500 600 700 IC, Collector Current (A) VCE, Collector-to-Emitter Voltage (V) Fig. 10 - Typical Switching Losses vs. Collector-to-Emitter Current Fig. 11 - Reverse Bias SOA www.irf.com 5 GA150KS61U 300 200 160 IF = 300A 200 IF = 300A IRRM - (A) IF = 150A 120 trr - (ns) IF = 150A IF = 75A IF = 75A 80 100 VR = 360V TJ = 125C TJ = 25C 0 500 1000 1500 2000 40 VR = 360V TJ = 125C TJ = 25C 0 500 1000 1500 2000 dif / dt - (A / s) dif / dt - (A / s) Fig. 12 - Typical Reverse Recovery vs. dif/dt 1000 Fig. 13 - Typical Recovery Current vs. dif/dt 14000 Instantaneous Forward Current - I F ( A ) 12000 IF = 300A IF = 150A IF = 75A 10000 100 Qrr - (nC) 8000 6000 T J = 125C T J = 25C 4000 2000 VR = 360V TJ = 125C TJ = 25C 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 500 1000 1500 2000 Forward Voltage Drop - V F ( V ) dif / dt - (A / s) Fig. 14 - Typical Forward Voltage Drop vs. Instantaneous Forward Current Fig. 15 - Typical Stored Charge vs. dif/dt 6 www.irf.com GA150KS61U L2 L1 DUT Vce L +Vge 90% Vge Vcc +Vg2 Rg2 Ic 10% Vce Ic 5% Ic td(off) tf 90% Ic -Vg2 Rg1 L3 Vcc=60% of BVces Ls= L1+L2+L3 Vge=15V Eoff = t1+5S Vce Ic Vce ic dtdt t1 Fig. 16a - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf t1 t2 Fig. 16b - Test Waveforms for Circuit of Fig. 16a, Defining Eoff, td(off), tf GATE VOLTAGE D.U.T. 10% +Vg +Vg trr Ic Qrr = trr id dt Ic dt tx tx 10% Vcc Vce 10% Ic 90% Ic DUT VOLTAGE AND CURRENT Ipk Ic 10% Irr Vcc Vpk Irr Vcc DIODE RECOVERY WAVEFORMS td(on) tr 5% Vce t2 Vce Ic Eon = Vce ie dt dt t1 t2 DIODE REVERSE RECOVERY ENERGY t3 t4 Erec = Vd idIc dt Vd dt t3 t1 t4 Fig. 16c - Test Waveforms for Circuit of Fig. 16a, Defining Eon, td(on), tr Fig. 16d - Test Waveforms for Circuit of Fig. 16a Defining Erec, trr, Qrr, Irr www.irf.com 7 GA150KS61U Vg GATE SIGNAL DEVICE UNDER TEST CURRENT D.U.T. VOLTAGE IN D.U.T. CURRENT IN D1 t0 t1 t2 Figure 16e. Macro Waveforms for Figure 17's Test Circuit RL = 0 - 480V 480V 4 X I C @25C Figure 17. Pulsed Collector Current Test Circuit 8 www.irf.com GA150KS61U Notes: Repetitive rating; VGE = 20V, pulse width limited by max. junction temperature. See fig. 16 For screws M5x0.8 Pulse width 80s; single shot. Case Outline -- INT-A-PAK 94.70 3.728 93.70 3.689] 80.30 79.70 [ NOT ES : 1. ALL DIMENSIONS ARE S HOWN IN MILLIMETERS [INCHES ]. 2. CONTROLLING DIMENS ION: MILLIMETER. 4.50 3.50 6 7 17.50 16.50 .650] [.689 .138] [.177 [ 3.161 3.138 ] 2X 23.50 22.50 .886] [.925 11 10 34.70 33.70 1.327] [1.366 1 8 9 2 3 5 4 6.80 2X O 6.20 .244] [.267 4X F AS TON TAB (110) 2.8 x 0.5 [.110 x .020] 3X M5 8 [.314] MAX. 42.00 41.00 1.614] [1.654 8.00 6.60 .260] [.315 24.00 23.00 .906] [.945 30.50 29.00 1.142 [1.201 ] 0.15 [.0059] CONVEX 92.10 91.10 3.587] [3.626 8.65 7.65 .301 [.341 ] 32.00 31.00 2X 13.30 12.70 .500] [.524 [ 1.260 1.220] Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR's Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.11/01 www.irf.com 9 |
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